Unlocking the full potential of Green Laser technology and highly-reflective and refractory metals for the world's most demanding industries. We transform complex engineering challenges into high-performance reality, delivering solutions ranging from advanced thermal management to extremetemperature aerospace components.
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Advanced Thermal Management
High Performance Induction
Propulsion Systems
Harnessing the superior thermal conductivity of Pure Copper and Copper Alloys via Green Laser printing. We engineer monolithic heat exchangers and liquid cold plates with complex internal channels, ensuring optimal cooling for high-power electronics and EVs.
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Maximizing electrical efficiency with high-density Pure Copper and optimized geometries. Our customized induction coils and busbars deliver superior conductivity and extended service life.
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Pushing the boundaries of flight with highly- reflective metals. We manufacture lightweight propulsion components and structural parts designed to withstand extreme temperatures and mechanical stress in the harshest environments.
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This is the most critical and frequently mentioned advanced application, utilizing TPMS to optimize fluid dynamics and heat exchange.
Core Structure :
Uses Gyroid, or Diamond lattice structures to fill flow channels.
Performance Advantage :
Provides massive Surface Area compared to traditional channels, ensuring uniform fluid distribution and eliminating Hot Spots.
Efficiency Boost :
Heat transfer performance improves by approximately 28% under the same pumping power, with significantly reduced flow resistance. Manufacturing :
Monolithic printing eliminates brazing and removes leakage risks.
Designed for IGBT power modules in EVs or industrial controls, breaking the limits of traditional cold-forged pin fins.
Background : Traditional Pin Fin technology has hit a thermal bottleneck.
Micro-structure Design:
●Bottom features Irregular concave and convex textures.
●Surface covered with Conical columns with spiral micro-structures, impossible with cold forging.
●Added Horizontal square strips for turbulence induction.
Results :
Thermal efficiency improved by 30%-40% within the same installation space.
For semiconductor components with extremely high heat flux density, demanding massive efficiency gains.
●Goal : Customer required a 5x efficiency increase over the original copper plate solution.
●Structure : Combines irregular textures, spiral micro-structure cones, and horizontal strips into a composite design.
●Test Results : Final tests showed a 6-7x increase in thermal efficiency.
●Process : 3D printed base plate + welded cover (Hybrid manufacturing).
Designed to minimize pressure drop and fluid resistance using hydrodynamic optimization.
●Core Design : Features an array of teardrop-shaped pin fins.
●Fluid Dynamics : Compared to cylindrical pins, the teardrop shape significantly reduces fluid flow separation and turbulence, leading to a much lower pressure drop.
●Efficiency: Maintains high heat transfer efficiency while allowing for lower pumping power or higher flow rates.
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Shenzhen Addireen Technologies Co., Ltd.
Building 7, Detai Technology Park, Dalang Street, Longhua District, Shenzhen, Guangdong, China.
(+86) 193-5719-8013
