Contact Us

whatsapp

TOP

Purchase Our Products
Last Name*
First Name*
Email*
Intended Product*

Please Select

XH-M100G

XH-M160G

XH-M350G

XH-M660G

Phone Number*
Corporate Name*

I confirm that I accept the Privacy Policy.

Yes

No

Pure copper

Overview

1. High copper purity, with copper content reaching 99.95%

2. Excellent thermal and electrical conductivity


Material Parameters

Particle Size

15-53μm,15-38μm,5-25μm

Flowability

≤ 20s

Bulk Density

≥4.9g/cm³

Oxygen Content

≤300ppm

Mechanical Properties

Tensile Strength

≥240MPa

Yield Strength

≥165MPa

Elongation

≥30%

Pure Copper

Download Data Sheet
Applications

Advanced Thermal Management

High Performance Induction

Propulsion Systems

Advanced Thermal Management

High Performance Induction

Propulsion Systems

Recommended Solutions

View All Series

Related Materials

Case Study

TPMS Liquid Cold Plates

TPMS Cooling Channels

- Lattice: Gyroid / Diamond

- Benefits: Max surface area, uniform flow, no hot spots

- Performance: +28% heat transfer, lower flow resistance

- Process: Monolithic print, no brazing/leaks


Teardrop-Shaped Liquid Cold Plates

Hydrodynamic Pin Fin Design

- Geometry: Teardrop-shaped pin fin array

- Advantage: Minimizes flow separation vs. cylindrical pins → significantly lower pressure drop

- Result: Maintains high heat transfer while reducing pumping power or enabling higher flow rates


Monolithic Pure Copper Induction Coil

- Application: High-frequency heating systems.  

- Material: Pure Copper (101% IACS).  

- Geometry: Seamless conformal cooling channels.  

- Advantage: Monolithic build eliminates brazing leaks.  

- Result: High structural rigidity & extended service life.

New Generation IGBT Heatsink Base Plate

IGBT Cooling – Beyond Forged Fins

- Limit: Forged fins hit bottleneck

- Innovation: 3D-printed micro-structures (bottom textures + spiral cones + horizontal strips)

- Gain: 30–40% higher thermal efficiency (same footprint)


Data Processor Thermal Module

- Replaces: Copper sheet heatsinks

- Design: Fin + needle/rectangular hybrids

- Function: Boosts surface area + guides flow

- Result: Significantly better thermal uniformity


Semiconductor Thermal Module

- Target: 5× efficiency vs. copper plate

- Design: Irregular textures + spiral cones + horizontal strips

- Result: 6–7× gain (verified)

- Process: 3D-printed base + welded cover (hybrid)


Conformal Channel Liquid Cold Plate

- Conformal channels: Follow 3D heat source contour (not just 2D plane)

- Internal features: Fin/pin/needle hybrids maximize turbulence & surface area

- Outcome: Solves uneven heating in complex geometries—impossible with traditional machining


Looking for 3D Printing Services?

For on-demand manufacturing, part production, and instant quotes, please visit  our dedicated Service Bureau platform by clicking the button to the right.

Printing Service

Unlock Green Laser Metal AM: Your Partner for Equipment & Services
Business Cooperation & Equipment Inquiries

Interested in acquiring our Green Laser AM systems or exploring partnership opportunities? Please fill out the form below, and our sales team will contact you shortly.

Company Name*
Name*
Intended Product*
Phone Number*
Email*

I confirm that I accept the Privacy Policy.

Subscribe
Sign up for product updates and promotions!

I agree to receive industry news, product and service promotions, and all other relevant Addireen communications.

Contact Us

Shenzhen Addireen Technologies Co., Ltd.

Building 7, Detai Technology Park, Dalang Street, Longhua District, Shenzhen, Guangdong, China.

(+86) 193-5719-8013

Copyright © 2026 Addireen. All Rights Reserved | 粤ICP备2024303078号-1