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Pure copper

Overview

1. High copper purity, with copper content reaching 99.95%

2. Excellent thermal and electrical conductivity


Material Parameters

Particle Size

15-53μm,15-38μm,5-25μm

Flowability

≤ 20s

Bulk Density

≥4.9g/cm³

Oxygen Content

≤300ppm

Mechanical Properties

Tensile Strength

≥240MPa

Yield Strength

≥165MPa

Elongation

≥30%

Pure Copper

Download Data Sheet
Applications

Advanced Thermal
Management

High Performance
Induction Coil

Aerospace & Defense

Advanced Thermal
Management

High Performance
Induction Coil

Aerospace & Defense

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Case Study

TPMS Liquid Cold Plates

Advantage: Monolithic, braze-free construction featuring complex TPMS lattices (Gyroid/Diamond) for optimal flow distribution.


Result: Boosts heat transfer by 28% while lowering flow resistance and effectively minimizing critical hot spots.


Teardrop-Shaped Liquid Cold Plates

Advantage: Advanced teardrop geometry for optimal fluid dynamics.


Result: Drastically reduces flow resistance, boosting heat transfer while lowering pump energy costs.


Monolithic Pure Copper Induction Coil

Advantage: Seamless pure copper (100% IACS) with custom conformal cooling.


Result: Eliminates common leak points and significantly minimizes thermal fatigue, delivering a vastly extended service life.


New Generation IGBT Heatsink Base Plate

Advantage: Bypasses traditional forged fin bottlenecks utilizing 3D-printed micro-structures, including optimized bottom textures and spiral cones.


Result: Drives a 30–40% increase in thermal efficiency within the exact same physical footprint.


Data Processor Thermal Module

Advantage: Advanced fin and needle/rectangular hybrid structures designed to actively guide fluid flow and maximize surface area.


Result: Outperforms traditional copper sheet heatsinks by achieving significantly enhanced thermal uniformity.


Semiconductor Thermal Module

Advantage: Hybrid construction featuring a 3D-printed base with complex micro-structures (irregular textures, spiral cones, and horizontal strips).


Result: Delivers a verified 6–7x thermal efficiency gain over traditional copper plates.


Conformal Channel Liquid Cold Plate

Advantage: True 3D conformal routing with internal fin/pin/needle hybrids. Impossible via traditional machining.


Result: Maximizes heat-transfer surface area to ensure highly uniform thermal distribution across complex components.


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