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Advanced Thermal Management
Integrating disruptive thermal structures with scalable mass production to break performance bottlenecks and empower the next generation of high-end thermal products.
Key Benefits
- Unlimited Design Freedom
Overcoming the limitations of traditional subtractive manufacturing to construct TPMS lattices, conformal cooling channels, and high-aspect-ratio micro-channels. This maximizes surface area and optimizes fluid dynamics for significantly improved heat exchange efficiency.
- Integrated & Leak-Proof
Achieving monolithic printing. This completely eliminates weak points caused by traditional brazing , fundamentally removing the risk of coolant leakage and ensuring long-term system reliability.
- Material Versatility
Resolving the printing of highly reflective metals like Pure Copper (density ~99.8%). This provides a one-stop solution covering diverse performance needs.
- Mold-Free Agile Iteration
Direct digital manufacturing eliminates the need for expensive mold development, shortening the R&D verification cycle from months to days. This reduces trial-and-error costs, making it perfectly suited for high-end customization and small-batch pre-research projects.
Materials
Case Study
TPMS Liquid Cold Plates
TPMS Cooling Channels
-Lattice: Gyroid / Diamond
-Benefits: Max surface area, uniform flow, no hot spots
-Performance: +28% heat transfer, lower flow resistance
-Process: Monolithic print, no brazing/leaks
New Generation IGBT Heatsink Base Plate
IGBT Cooling – Beyond Forged Fins
- Limit: Forged fins hit bottleneck
- Innovation: 3D-printed micro-structures (bottom textures + spiral cones + horizontal strips)
- Gain: 30–40% higher thermal efficiency (same footprint)
Data Processor Thermal Module
- Replaces: Copper sheet heatsinks
- Design: Fin + needle/rectangular hybrids
- Function: Boosts surface area + guides flow
- Result: Significantly better thermal uniformity
Semiconductor Thermal Module
- Target: 5× efficiency vs. copper plate
- Design: Irregular textures + spiral cones + horizontal strips
- Result: 6–7× gain (verified)
- Process: 3D-printed base + welded cover (hybrid)
Teardrop-Shaped Liquid Cold Plates
Hydrodynamic Pin Fin Design
- Geometry: Teardrop-shaped pin fin array
- Advantage: Minimizes flow separation vs. cylindrical pins → significantly lower pressure drop
- Result: Maintains high heat transfer while reducing pumping power or enabling higher flow rates
Conformal Channel Liquid Cold Plate
- Conformal channels: Follow 3D heat source contour (not just 2D plane)
- Internal features: Fin/pin/needle hybrids maximize turbulence & surface area
- Outcome: Solves uneven heating in complex geometries—impossible with traditional machining
Aluminum Alloy Heat Exchangers
- Material: AlSi10Mg – lightweight, high conductivity
- Structure: 0.08mm walls + internal lattices → enhanced mixing
- Advantage: No brazing → zero leaks; topology-optimized → lighter
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Shenzhen Addireen Technologies Co., Ltd.
Building 7, Detai Technology Park, Dalang Street, Longhua District, Shenzhen, Guangdong, China.
(+86) 193-5719-8013
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