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Advanced Thermal Management
Integrating disruptive thermal structures with scalable mass production to break performance bottlenecks and empower the next generation of high-end thermal products.
Key Benefits
●Unlimited Design Freedom
Overcoming the limitations of traditional subtractive manufacturing to construct TPMS lattices, conformal cooling channels, and high-aspect-ratio micro-channels. This maximizes surface area and optimizes fluid dynamics for significantly improved heat exchange efficiency.
●Integrated & Leak-Proof
Achieving monolithic printing. This completely eliminates weak points caused by traditional brazing , fundamentally removing the risk of coolant leakage and ensuring long-term system reliability.
●Material Versatility
Resolving the printing of highly reflective metals like Pure Copper (density ~99.8%). This provides a one-stop solution covering diverse performance needs.
●Mold-Free Agile Iteration
Direct digital manufacturing eliminates the need for expensive mold development, shortening the R&D verification cycle from months to days. This reduces trial-and-error costs, making it perfectly suited for high-end customization and small-batch pre-research projects.
Materials
Case Study
TPMS Liquid Cold Plates
This is the most critical and frequently mentioned advanced application, utilizing TPMS to optimize fluid dynamics and heat exchange.
Core Structure :
Uses Gyroid, or Diamond lattice structures to fill flow channels.
Performance Advantage :
Provides massive Surface Area compared to traditional channels, ensuring uniform fluid distribution and eliminating Hot Spots.
Efficiency Boost :
Heat transfer performance improves by approximately 28% under the same pumping power, with significantly reduced flow resistance.
Manufacturing :
Monolithic printing elimi
Core Structure :
Uses Gyroid, or Diamond lattice structures to fill flow channels.
Performance Advantage :
Provides massive Surface Area compared to traditional channels, ensuring uniform fluid distribution and eliminating Hot Spots.
Efficiency Boost :
Heat transfer performance improves by approximately 28% under the same pumping power, with significantly reduced flow resistance.
Manufacturing :
Monolithic printing elimi
New Generation IGBT Heatsink Base Plate
Designed for IGBT power modules in EVs or industrial controls, breaking the
limits of traditional cold-forged pin fins.
Background : Traditional Pin Fin technology has hit a thermal bottleneck.
Micro-structure Design :
Bottom features Irregular concave and convex textures.
Surface covered with Conical columns with spiral micro-structures, impossible with cold forging.
Added Horizontal square strips for turbulence induction.
Results : Thermal efficiency improved by 30%-40% within the same installation space.
Background : Traditional Pin Fin technology has hit a thermal bottleneck.
Micro-structure Design :
Bottom features Irregular concave and convex textures.
Surface covered with Conical columns with spiral micro-structures, impossible with cold forging.
Added Horizontal square strips for turbulence induction.
Results : Thermal efficiency improved by 30%-40% within the same installation space.
Data Processor Thermal Module
Addressing poor thermal uniformity in traditional heatsinks for servers or highperformance chips.
Replacement : Replaces copper sheet heatsinks.
Design Change : Internally features a fin-based, needle+rectangularbased, and a combination of multiple structures.
Function : Increases surface area and acts as a fluid Guide, significantly improving thermal uniformity.
Replacement : Replaces copper sheet heatsinks.
Design Change : Internally features a fin-based, needle+rectangularbased, and a combination of multiple structures.
Function : Increases surface area and acts as a fluid Guide, significantly improving thermal uniformity.
Semiconductor Thermal Module
For semiconductor components with extremely high heat flux density,
demanding massive efficiency gains.
Goal : Customer required a 5x efficiency increase over the original copper
plate solution.
Structure : Combines irregular textures, spiral micro-structure cones, and
horizontal strips into a composite design.
Test Results : Final tests showed a 6-7x increase in thermal efficiency.
Process : 3D printed base plate + welded cover (Hybrid manufacturing).
Teardrop-Shaped Liquid Cold Plates
Designed to minimize pressure drop and fluid resistance using hydrodynamic
optimization.
Core Design : Features an array of teardrop-shaped pin fins.
Fluid Dynamics : Compared to cylindrical pins, the teardrop shape significantly reduces fluid flow separation and turbulence, leading to a much lower pressure drop.
Efficiency: Maintains high heat transfer efficiency while allowing for lower pumping power or higher flow rates.
Core Design : Features an array of teardrop-shaped pin fins.
Fluid Dynamics : Compared to cylindrical pins, the teardrop shape significantly reduces fluid flow separation and turbulence, leading to a much lower pressure drop.
Efficiency: Maintains high heat transfer efficiency while allowing for lower pumping power or higher flow rates.
Conformal Channel Liquid Cold Plate
Utilizing 3D printing freedom to create non-linear, conformal cooling channels.
Conformal Cooling : Channels are designed to follow the 3D contour of the
heat source, rather than a simple 2D plane.
Internal Features : Internally features a fin-based, needle+rectangularbased, and a combination of multiple structures to maximize turbulence
and surface area in critical zones.
Benefits : Solves the issue of uneven heating in complex-shaped
components where traditional machining cannot reach.
Aluminum Alloy Heat Exchangers
Lightweight, high-strength heat exchangers for automotive applications,
overcoming traditional brazing limits.
Material : High-strength Aluminum Alloy (e.g., AlSi10Mg), offering a balance of low weight and good thermal conductivity.
Structure : Monolithic printing. Features extremely thin walls (down to 0.2mm) and complex internal lattices for fluid mixing.
Advantage : Eliminates the risk of leakage at joints common in brazed aluminum exchangers and allows for topology optimization to reduce weight .
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Building 7, Detai Technology Park, Dalang Street, Longhua District, Shenzhen, Guangdong, China.
(+86) 193-5719-8013
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